WESI Technology宣布推出MEMS制造完整方案

WESI Technology宣布推出MEMS器件制造的完整方案。该方案包括一条完整的设备线，可满足MEMS制造的全部工序，同时还提供MEMS工艺流程设计、晶圆厂建设和成品率改善等方面的咨询服务。

WESI TECHNOLOGY LTD ANNOUNCES TURN-KEY SOLUTION FOR MEMS WAFER MANUFACTURING

Shanghai, China, May 21, 2009 - WESI Technology Ltd (www.wesitechnology.com) announced availability of its turn-key solution for manufacturing of MEMS devices. The turn-key solution includes a complete line of tools necessary for all processing steps of MEMS fabrication, as well as consulting services for MEMS process flow design, fab start-up, and continual yield improvement.

WESI integrates processing tools from the most established partners, such as Tegal for Dry Etch, Deep Reactive Ion Etch (DRIE) and PVD; memsstar? for Dry Release Etching and Surface Modification; SPEC for Wet Etch, Electroplating and Electroless Deposition; WaferMasters for Thermal Processing; and ECI for Online Process Monitoring; as well as other equipment from leading 3rd party OEM’s. WESI also advises customers on selection of proven consumables necessary for manufacturing MEMS devices.

WESI will share its in-depth knowledge of wafer processing as well as extensive work experiences in wafer fabs with our customers, to guide customers making the best decisions for MEMS manufacturing. Collectively, WESI’s staffs have over a dozen US patents related to wafer processing as well as decades of experience in servicing fab equipment.

“Regardless of the customer’s level of experience and budget size, we can provide the optimal standalone or integrated tool package and help the customer start production effortlessly in the shortest possible time,” commented Dr. Chenting Lin, WESI’s director. “Our involvement does not stop at launching a new line. We continue to advise customers to progressively improve their yields and adapt new technologies.”

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