当前位置:首页 > 模拟 > 模拟
[导读]PALM SPRINGS, CALIFORNIA, Feb 19, 2010 (MARKETWIRE via COMTEX) -- APEC - DALSA Corporation /quotes/comstock/11t!dsa (CA:DSA 8.51, -0.04, -0.47%) , a world-leadi

PALM SPRINGS, CALIFORNIA, Feb 19, 2010 (MARKETWIRE via COMTEX) -- APEC - DALSA Corporation /quotes/comstock/11t!dsa (CA:DSA 8.51, -0.04, -0.47%) , a world-leading semiconductor and MEMS foundry, will feature its latest advancements in MEMS and HV CMOS fabrication along with its innovative HV ASIC design capabilities at APEC in Palm Springs, CA, February 21 - 25 2010, booth #546. APEC is the premier event in applied power electronics focusing on the practical and applied aspects of the power electronics business.

DALSA's design and foundry showcase at APEC

MEMS Foundry - DALSA is renowned for its extensive experience with advanced fabrication strategies such as stacking circuits to reduce package size or combining MEMS and CMOS wafers to integrate sense and actuation with logic circuits. DALSA delivers field-proven 3D and wafer level packaging technologies including through-silicon vias and a wide range of wafer bonding techniques.

HV CMOS Fabrication - DALSA has a long history in high voltage circuits and we offer a variety of HV CMOS/DMOS processes to cover applications from MEMS actuation and control to power management. As always, DALSA's experience and exceptional process portfolio allows the flexibility to optimize for diverse applications.

HV ASIC Design - Take advantage of DALSA's years of expertise combining HV and MEMS designs with a system level perspective and specialized Engineering Design Assistance (EDA) tools to turn your requirements into a custom, purpose-built solution with optimal, differentiating performance for true competitive advantage.

Customer Interaction / Business Partnerships - With a technology portfolio as wide and flexible as DALSA's, with deliverables as varied as ours, excellence in planning, quality assurance, and customer interaction are not optional activities-they are fundamental business requirements. Only through the dedication of DALSA's engineers, technicians, and operators to exceptional project management, comprehensive resource planning, rigorous quality methodologies, and devoted customer communication has the company achieved its global reputation for success.

Where: APEC
Palm Springs Convention Center
Palm Springs, California, USA
Booth #546
When: February 21 - 25, 2010




About DALSA Semiconductor

Located in Bromont, Quebec, Canada, DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. Visit www.dalsa.com/semi/.

About DALSA Corporation

DALSA /quotes/comstock/11t!dsa (CA:DSA 8.51, -0.04, -0.47%) is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing semiconductor products and services. For more information, visit www.dalsa.com.

All trademarks are registered by their respective companies. DALSA reserves the right to make changes at anytime without notice.

Contacts:
Media Contact:
Red Javelin Communications, Inc.
Maria Doyle
+1-781-964-3536
maria@redjavelin.com







    
本站声明: 本文章由作者或相关机构授权发布,目的在于传递更多信息,并不代表本站赞同其观点,本站亦不保证或承诺内容真实性等。需要转载请联系该专栏作者,如若文章内容侵犯您的权益,请及时联系本站删除。
换一批
延伸阅读

9月2日消息,不造车的华为或将催生出更大的独角兽公司,随着阿维塔和赛力斯的入局,华为引望愈发显得引人瞩目。

关键字: 阿维塔 塞力斯 华为

加利福尼亚州圣克拉拉县2024年8月30日 /美通社/ -- 数字化转型技术解决方案公司Trianz今天宣布,该公司与Amazon Web Services (AWS)签订了...

关键字: AWS AN BSP 数字化

伦敦2024年8月29日 /美通社/ -- 英国汽车技术公司SODA.Auto推出其旗舰产品SODA V,这是全球首款涵盖汽车工程师从创意到认证的所有需求的工具,可用于创建软件定义汽车。 SODA V工具的开发耗时1.5...

关键字: 汽车 人工智能 智能驱动 BSP

北京2024年8月28日 /美通社/ -- 越来越多用户希望企业业务能7×24不间断运行,同时企业却面临越来越多业务中断的风险,如企业系统复杂性的增加,频繁的功能更新和发布等。如何确保业务连续性,提升韧性,成...

关键字: 亚马逊 解密 控制平面 BSP

8月30日消息,据媒体报道,腾讯和网易近期正在缩减他们对日本游戏市场的投资。

关键字: 腾讯 编码器 CPU

8月28日消息,今天上午,2024中国国际大数据产业博览会开幕式在贵阳举行,华为董事、质量流程IT总裁陶景文发表了演讲。

关键字: 华为 12nm EDA 半导体

8月28日消息,在2024中国国际大数据产业博览会上,华为常务董事、华为云CEO张平安发表演讲称,数字世界的话语权最终是由生态的繁荣决定的。

关键字: 华为 12nm 手机 卫星通信

要点: 有效应对环境变化,经营业绩稳中有升 落实提质增效举措,毛利润率延续升势 战略布局成效显著,战新业务引领增长 以科技创新为引领,提升企业核心竞争力 坚持高质量发展策略,塑强核心竞争优势...

关键字: 通信 BSP 电信运营商 数字经济

北京2024年8月27日 /美通社/ -- 8月21日,由中央广播电视总台与中国电影电视技术学会联合牵头组建的NVI技术创新联盟在BIRTV2024超高清全产业链发展研讨会上宣布正式成立。 活动现场 NVI技术创新联...

关键字: VI 传输协议 音频 BSP

北京2024年8月27日 /美通社/ -- 在8月23日举办的2024年长三角生态绿色一体化发展示范区联合招商会上,软通动力信息技术(集团)股份有限公司(以下简称"软通动力")与长三角投资(上海)有限...

关键字: BSP 信息技术
关闭
关闭