世平集团推出 RockChip + Spreadtrum 3G智能手机方案
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IDC 近期发布研究报告称，今年全球手机厂商的手机出货总量将会达到近 18 亿部, 预计今年智能手机的出货量将为 6.86 亿部，比去年增长 38.8%。现今智能手机多样化的功能，对越来越多的的用户来说，都日益成为一种更具吸引力的选择。
手机用户从功能手机到智能手机的过渡期仍将持续进行。在这个重要的变革时期，大联大旗下世平集团为推波助澜而推出RockChip + Spreadtrum 3G 智能手机方案，期能带给客户更多吸引力的商机。
方案框图：
主要芯片介绍：
Rockchip RK30XX
Features：
CPU
Dual-core Cortex-A9
1.2-1.5GHz
GPU
Mali-400MP GPU
Support OPENGL ES 1.1/2.0
High performance dedicated 2D/3D processor
VPU
1080p full-format video decoder
1080p video encoder for H.264/MVC/VP8
Interface
Support DDR3/LPDDR2 with high-perf
Embedded 60bits ECC, support MLC NAND Flash
Dual panel display
Dual camera supported
Embedded HDMI 1.4a
Rich peripheral and connectivity
Spreadtrum SC880xG
Features：
ARM926EJa 32-bit RISC processor, up to 550 MHz
High performance multi-layer AHB-Lite bus system and low power APB system
Signal processing for modem functions is mainly implemented in DSP sub system, and the embedded DSP sub-system includes
CEVA-Xa 1622 64 bit fixed point DSP core
The instruction set is VLIW and SIMD, optimized for communication and multi-media processing
System timing
For GSM/GPRS/EDGE, recommend usinga low swing 26 MHz master clock input. For TD-SCDMA, an on-chip PLL will provide specification required Rx/Tx clock
Programmable TDMA timing with 1/8 chip resolution in TD-SCDMA mode and 1/4 symbol resolution in GSM mode
Time tracking in power saving mode
Support inter-RAT handover: GSM/GPRS/EDGE to TD-SCDMA, as well as TD-SCDMA to GSM/GPRS/EDGE
16 general RFCTL wires for RF chip or antenna control
1 dedicated SPI ports for BB-RF chip communication
12-bit D/A converter with programmable gain for Automatic Frequency Control (AFC)
10-bit D/A converter with programmable gain
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